NEDIS
Cooling paste | ≥1.63W/mk | White
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Features
• High stability and reliability
• Suitable for CPUs, UPSs, inverters, chipsets and other PC parts
• Low thermal resistance, high thermal conductivity
Description
This Nedis® cooling paste is highly thermally conductive. It can be used to fill the microscopic impurities on the heatsink and CPU/GPU, where air bubbles can form and impair the heatsink's performance. The cooling paste ensures that heat can be dissipated or dissipated very effectively. This allows you to run large programs without the motherboard overheating.
Scope of delivery
Cooling paste syringe
Application spatula
Additional features
• High stability and reliability
• Suitable for CPUs, UPSs, inverters, chipsets and other PC parts
• Low thermal resistance, high thermal conductivity
Description
This Nedis® cooling paste is highly thermally conductive. It can be used to fill the microscopic impurities on the heatsink and CPU/GPU, where air bubbles can form and impair the heatsink's performance. The cooling paste ensures that heat can be dissipated or dissipated very effectively. This allows you to run large programs without the motherboard overheating.
Scope of delivery
Cooling paste syringe
Application spatula
Additional features
- Height mm: 185
- Thixotropy number: 350 ± 10
- Viscosity: 1000
- Width mm: 20
- Specific gravity: ≥2
- Type: Insert
- Color: White
- Number of products in the box: 1 piece
- Length mm: 95
- moment stored temperature: -50-340 °C
- Operating temperature range: -30 - 300 °C
- Thermal impedance: ≤0.249 °C-in²/W
- Thermal conductivity: ≥1.63W/mk